BAE Systems Touts Advanced Chip For Comms, EW and SIGINT Systems
The company’s US-based Electronics Systems business has used DARPA funding to develop flexible, wide-spectrum integrated circuits.
The MATRICs chip enables a variety of ‘cognitive RF’ systems. (Photo: BAE Systems)
The MATRICs chip enables a variety of ‘cognitive RF’ systems. (Photo: BAE Systems)

The U.S.-based Electronics Systems business of BAE Systems announced the development of a new general-purpose chip that can help radio systems adapt to a wide range of frequencies. The applications include electronic warfare and SIGINT (Signals Intelligence) systems, as well as communications systems. The company claims that its Microwave Array Technology for Reconfigurable Integrated Circuits (MATRICs) can replace Application-Specific Integrated Circuits (ASICS) “that are expensive and time-consuming to develop.”